Compact specimen processing station

ABSTRACT

The present invention is a compact specimen processing station (10) that processes vertically oriented specimens. Specimen storage, transport, and inspection components (26, 28, and 30) are all mounted to a vibration-damped support structure (14) and are designed to handle specimens (34) positioned with a generally vertical orientation. The station is designed to minimize undesirable specimen motion and contamination caused by an operator (42). A specimen processing station (10) that performs inspection functions is equipped with a processing means (32) and a display monitor (36) that provide a real image and a video image, respectively, of a microscopic region of the specimen under inspection. The station is equipped with failsafe mechanisms (176 and 182) that prevent the dropping of a specimen during an electrical power failure or a vacuum pressure loss.

This application is a continuation-in-part of U.S. patent applicationSer. No. 07/405,343 filed Sep. 11, 1989, now U.S. Pat. No. 5,331,458.

TECHNICAL FIELD

The present invention relates to specimen processing stations and, inparticular, to a specimen processing station in which the specimen isstored and processed while positioned in a generally verticalorientation.

BACKGROUND OF THE INVENTION

A specimen processing station is adapted to perform manufacturing,inspecting, sorting, or other processing operations on a selectedarticle or specimen. The specimen processing station is typicallyadapted to process a preselected type of specimen such as electroniccomponents (e.g., printed circuit boards, semiconductor wafers,electronic circuits, or photomasks), mechanical assemblies orsubassemblies, or chemical products. The following backgroundinformation is presented herein only by way of example with reference toa semiconductor wafer defect inspection station.

A conventional semiconductor wafer fabrication process entails detectionand inspection of defects in the patterned surface of a specimen wafer.The in-process inspection for defects is typically accomplished with theuse of an operator-controlled inspection station that includes amicroscope and a television-type display monitor for viewing the minutedetail of the patterned surface in a small region of the wafer.

The wafer is typically secured by vacuum pressure or other means to anX-Y translation stage that moves the wafer in a horizontal plane. Themicroscope optically communicates with a fixed region in space above theX-Y stage, the fixed region being defined by the field of view of themicroscope objective. The X-Y stage moves the wafer to selectablepositions in the horizontal plane to present different regions of thewafer within the field of view of the microscope objective. A videocamera optically coupled to the microscope provides video signalsrepresentative of the region of the wafer presented to the microscopeobjective. The operator is, therefore, able to select a region of thewafer for inspection and view the region through the microscope eyepieceor a video image of the region displayed on the monitor.

There are several design considerations affecting the physical layout ofand equipment used in a specimen inspection station. Such designconsiderations stem primarily from the presence of an operator and heror his movements during normal use of the inspection station.

First, the operator uses a keyboard to manually enter data delivered toa computer that generates commands to operate the X-Y stage and performother functions necessary to locate, identify, and classify defects inthe specimen wafer under inspection. Vibration isolation is, therefore,sometimes used to prevent normal operator movements from affecting thestability of the wafer region positioned within the field of view of themicroscope objective.

Second, human contamination introduced by the operator is a significantcontributor to in-process wafer defects. To combat this problem, specialequipment providing a clean room environment is sometimes used.

Third, the ergonomics of coordinating the placement of operatorequipment such as the keyboard, the microscope, and display monitor foroperator convenience and ease of use dictates the layout and size of awork space needed for the specimen inspection station components. Thesize of the specimen that is to undergo inspection can also affect thesize of the work space.

Finally, the horizontal disposition of a very large area specimen on theX-Y stage can cause the specimen to deflect under its own weight andthereby necessitate the use of a stage having a large surface area toreduce the amount of stress borne by the specimen during inspection.

SUMMARY OF THE INVENTION

An object of the present invention is, therefore, to provide a compactspecimen processing station.

Another object of the invention is to provide a processing station thatminimizes specimen motion induced by operator-caused vibration.

A further object of the invention is to provide a processing stationhaving a component layout that reduces the likelihood of humancontamination of the specimen being processed.

Still another object of the invention is to provide a processing stationthat features good ergonomic design, occupies a compact work space, andexerts less stress on the specimen under processing.

Yet a further object of this invention is to provide a processingstation that is adapted for inspecting a specimen.

The present invention is a specimen processing station having componentsthat are oriented so that the specimen is stored, transported, andprocessed while positioned in a generally vertical orientation. Theprocessing station positions the specimen to undergo any of a widevariety of processing steps, such as specimen inspection, machining,testing, trimming, wire bonding, drilling, and the like. The presentinvention is described below by way of example with reference to asemiconductor wafer defect inspection station, but the salient featuresof the inspection station are equally applicable to different specimensand processing functions.

The inspection station components include a wafer storage cassettepositioned on a horizontal shelf so that multiple semiconductor waferscan be stored spaced apart from one another with their patternedsurfaces oriented vertically. Each wafer is stored in a different one ofthe slots of the storage cassette. The shelf is attached to avibration-damped support structure to which all of the specimen storage,transport, and inspection components are mounted. An automated waferhandler and an X-Y translation stage are mounted to an upright rearmember of the support structure. The wafer handler transports a selectedone of the wafers from its slot in the storage cassette to the X-Ystage. The wafer handling surfaces of the wafer handler and X-Y stagelie in vertical planes. The X-Y stage holds the wafer and translates itin a vertical plane so that different regions of the wafer surface liewithin the field of view of a microscope objective for inspection.

The wafer handler and the X-Y stage are connected to a vacuum pressuresystem for holding the wafer and thereby maintaining its verticalorientation during transportation and inspection. The wafer handler hasa rotatable platform to which a paddle structure that includes a pair ofpaddles is mounted for rotation at an angular velocity independent ofthat of the platform. The coordinated rotational motion of the platformand paddle structure in cooperation with a telescopic extensioncapability of the wafer handler allows a paddle to lift a selected oneof the wafers vertically from its slot in the storage cassette andposition the selected wafer on the platform. Vacuum pressure deliveredto the paddle and platform secure the wafer to them.

The wafer handler first performs an edge scan of the wafer to determineits center offset and angular orientation in the vertical plane. Usingthe paddle, the wafer handler then transfers the wafer in a desiredangular orientation to the wafer handling surface of the X-Y stage.Vacuum pressure delivered to the X-Y stage secures the wafer to the X-Ystage. In response to an operator command, the X-Y stage moves aselected region of the wafer into the field of view of a microscopeobjective, which is positioned near the patterned surface of the wafer.The microscope is mounted to the base of the X-Y stage on the uprightmember and is positioned so that the eyepiece through which the operatorlooks is located a horizontal distance away from the wafer surface,thereby decreasing the likelihood of operator contamination duringinspection. A video camera is optically coupled to the microscope togenerate video signals representative of the image seen by the operator.A display monitor supported on the upright member provides the operatorwith a conveniently placed video display image of the region within thefield of view of the microscope objective.

The above-described component layout exhibits superior ergonomic designcharacteristics while providing a compact inspection station thatminimizes the likelihood of operator contamination and eliminatesdeflection forces on the wafer resulting from its own weight.Additionally, the inspection station includes failsafe systems forensuring that the wafer under inspection is not dropped in the event ofelectrical power failure or vacuum pressure loss.

Additional objects and advantages of the present invention will beapparent from the detailed description of a preferred embodimentthereof, which proceeds with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a frontal elevation view of the specimen inspection station ofthe present invention;

FIG. 2 is a right side elevation view of the specimen inspection stationshown in FIG.;

FIG. 3 is a plan view of the specimen inspection station shown in FIG.1;

FIGS. 4A, 4B, and 4C are schematic diagrams showing the orientation ofthe wafer handler as a wafer is, respectively, acquired from andreturned to the storage cassette, centered on the wafer handler, anddelivered to the X-Y stage for inspection;

FIG. 5 is a fragmentary isometric view showing the wafer handler, X-Ystage, and storage cassette arranged to accommodate a wafer positionedin a vertical orientation and shown in phantom in different locations inthe inspection station;

FIG. 6 shows a wafer positioned on the specimen handling platform of thewafer handler shown in FIG. 5,

FIG. 7 is a simplified block diagram of a scan data processing systemthat computes the position and orientation of a wafer to facilitate itsdelivery to the X-Y stage for inspection;

FIG. 8 is a composite block diagram and flow diagram for explaining theoperation of the present invention in response to a loss of electricalpower or vacuum pressure; and

FIG. 9 is a right side elevation view showing a vertical processingstation similar to the inspection station shown in FIG. 2.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENT

One preferred embodiment of the present invention illustrated in thedrawings and described in detail herein is directed to a processingstation for microscopic inspection of semiconductor wafers. A widevariety of specimens, such as printed circuit boards, electroniccircuits, photomasks, mechanical assemblies and subassemblies and thelike may be processed using the apparatus and methods described herein.Likewise, a broad spectrum of processing functions may be performed bythe processing station, including mechanical processing operations suchas drilling, trimming, wire bonding and the like; electrical testing;laser-assisted operations; and a variety of other processing operations.

With reference to FIGS. 1-3, specimen processing station 10 includes aninternally vibration-damped support structure 12 having an upright rearmember 14 and a front bench member 16. An example of such a supportstructure is an RS Series table manufactured by Newport Corporation,Fountain Valley, Calif. Support structure 12 is of integral constructiondesign and is supported on a floor 18 by three vertically adjustablefeet 20, two in the front and one in the rear.

Rear member 14 has a vertical planar front surface 22 with a steppedupper surface 24. A semiconductor wafer storage cassette 26, anautomatic robotic wafer handler 28, an X-Y translation stage 30, and abinocular microscope 32 are secured to front surface 22 in a compactarrangement that facilitates the transfer and inspection of asemiconductor wafer 34 positioned in a generally vertical orientation,as will be further described below.

A television-type image display monitor 36 rests on a ledge 38 of uppersurface 24. The height of ledge 38 above a planar horizontal surface 40of bench member 16 provides an operator 42 with a direct view of thedisplay surface 44 of monitor 36 when operator 42 is seated in front ofthe eyepiece 46 of microscope 32. A video camera 48 coupled tomicroscope 32 by way of an optical beamsplitter 50 delivers to displaymonitor 36 video signals representing the image within the field of viewof an objective 52 of microscope 32. Microscope 32 and display monitor36 provide operator 42 with, respectively, a direct image and a videodisplay image of defects in the region of the patterned surface 54 ofwafer 34 that is within the field of view of microscope objective 52.

A shelf 56 is supported above surface 40 by four extensible mountinglegs 58 that are releasably secured within bench member 16. Legs 58 arevertically adjustable within bench member 16 to provide shelf 56 with anadjustable height. A keyboard 60 and a storage box 62 together with anyother operator equipment lie on shelf 56. Operator 42 uses keyboard 60to enter commands and other data to a microprocessor-based computer (notshown) that controls the operation of inspection station 10. Storage box62 holds an extra storage cassette for later use with processing station10.

An inspection operation is carried out with the use of processingstation 10 as described below. FIGS. 4A, 4B, and 4C are schematicdiagrams showing the orientation of wafer handler 28 as a wafer 34 is,respectively, acquired from and returned to storage cassette 26,centered on wafer handler 28, and delivered to X-Y stage 30 forinspection. With reference to FIGS. 1-3 and 4A-4C, wafer handler 28 hasa rotatable specimen handling platform 70 to which a paddle structure 72having a pair of paddles 74a and 74b is rotatably mounted. Platform 70and paddle structure 72 rotate independently of each other about ahorizontal central axis 76 and a horizontal paddle axis 78,respectively. Platform 70 is positionable along the length of centralaxis 76 to position paddle structure 72 to engage a selected one of thewafers 34 stored in storage cassette 26. Storage cassette 26 is clampedto rear member 14 so that the wafers 34 stored therein are verticallyoriented and can be removed by lifting them straight up and out ofstorage cassette 26.

The coordinated rotational motion of platform 70 and paddle structure 72causes paddle 74a to contact wafer 34, as shown in FIG. 4A, and withvacuum pressure delivered through a paddle vacuum chuck 80a, to acquirewafer 34 and position it over a central vacuum chuck 82 on platform 70.The application of vacuum pressure to central vacuum chuck 82 secureswafer 34 in place in a vertical orientation to platform 70. Paddle 74athen moves out from behind wafer 34, i.e., out of the space betweenwafer 34 and platform 70. Because paddle structure 72 has paddles thatare capable of supporting and holding the specimen (e.g., wafer 34)without regard to the orientation of the paddles or the specimen, paddlestructure 72 is capable of acquiring, manipulating, and securing thespecimen in a vertical or any other orientation and operatingindependently of gravitational forces. This feature provides greaterflexibility of use and facilitates multiple processing operations, sinceit permits manipulation of the specimen in a variety of specialorientations. Paddle structure 72 can be adapted for use with a widerange of specimen types and sizes.

Platform 70 rotates 360 degrees to optically scan and compute a polarcoordinate map of wafer 34 to determine the locations of its center andflat. Upon determining the center location, paddle 74a moves back behindwafer 34, as shown in FIG. 4B, and with vacuum pressure deliveredthrough paddle vacuum 80a acquires wafer 34. The coordinated rotationalmotion of platform 70 and paddle structure 72 causes paddle 74a todeliver wafer 34 to an upper stage 84 of X-Y translation stage 30, whichis shown in FIG. 4C displaced in phantom from the nominal position ofFIGS. 4A and 4B to indicate the wafer receiving position of X-Y stage30. The delivery path followed by wafer 34 places it in a desiredorientation over a vacuum chuck 86 on X-Y stage 30. Vacuum pressuredelivered to vacuum chuck 86 secures wafer 34 in place in a verticalorientation to X-Y stage 30. The known placement of wafer 34 isaccomplished by computing the rotational motions of platform 70 andpaddle structure 72 needed to deliver wafer 34 in its computedorientation from platform 70 to its desired orientation on X-Y stage 30.A vacuum pressure control system ensures that wafer 34 is always undervacuum pressure during the placement and removal of wafer 34 on vacuumchuck 82 and the transfer of wafer 34 between wafer handler 28 and X-Ystage 30 as described below in greater detail.

Microscope 32 includes a body member 88 that is bolted directly to abase member 90 of X-Y stage 30 on rear member 14. Body member 88 isconfigured such that microscope objective 52 is positioned in front ofpatterned surface 54 of wafer 34. Operator 42 looks through eyepiece 46to inspect the region of wafer 34 within the field of view of objective52. X-Y stage 30 is operable to move wafer 34 along a vertical planeparallel to surface 22 of rear member 14 so that any location onpatterned surface 54 of wafer 34 can be positioned within the field ofview of microscope objective 52.

Operator 42 uses keyboard 60 to enter commands that cause X-Y stage 30to move a desired region of wafer 34 within the field of view ofmicroscope objective 52. Upon completion of an inspection, wafer handler28 positions paddle structure 72 to remove wafer 34 from X-Y stage 30and return wafer 34 to its designated slot in storage cassette 26 asshown in FIG. 4A.

FIG. 5 is a diagram of robotic wafer handler 28 for transporting wafer34 (shown in phantom) between wafer storage cassette 26 and X-Y stage30. Wafer handler 28 and X-Y stage 30 are of the types manufactured byKensington Laboratories, Inc. of Richmond, Calif., the assignee of thepresent application. It will be appreciated that weights provided in awafer handler designed to counterbalance the force of gravity are notneeded in wafer handler 28.

Wafer handler 28 includes a top cylinder 100a that is concentric withand overlaps a base cylinder 100b. Base cylinder 100b extends throughand out the rear surface of upright member 14. Top cylinder 100a carriesa specimen handling platform 70 on its top side. Top cylinder 100a,together with platform 70, is rotatable about and movable along centralaxis 76. Wafer handler 28 is characterized, therefore, as having a"waist" between cylinders 100a and 100b. (In FIG. 5, the waist line isobscured within the interior of upright member 14.)

Platform 70 includes a nonrotatable central pedestal 104 that is axiallyaligned with and movable along central axis 76. A wafer paddle pedestal106 positioned near the periphery of platform 70 supports paddlestructure 72, which includes wafer paddles 74a and 74b. Paddles 74a and74b are rotatable on wafer paddle pedestal 106 about a paddle axis 78,which is substantially parallel to central axis 76.

Central pedestal 104 includes central vacuum chuck 82 that is axiallyaligned with central axis 76. A microprocessor-controlled drivemechanism (not shown) included within wafer handler 28 coordinates therotation of platform 70 about central axis 76 and the rotation ofpaddles 74a and 74b about paddle axis 78 to achieve the desired movementfor transporting wafer 34 between cassette 26 and X-Y stage 30.

For example, wafer handler 28 acquires wafer 34 from storage cassette 26by positioning wafer paddle 74a behind the wafer. Platform 70 is thenmoved forward by extending cylinder 100a along axis 76 so that paddle74a engages wafer 34. Vacuum pressure applied to paddle vacuum chuck 80ain paddle 74a secures wafer 34 to the paddle. Wafer handler 28 moveswafer 34 along a straight-line path 110 from storage cassette 26.

A microprocessor circuit 112 (FIG. 7) controls the drive mechanism thatrotates platform 70 about central axis 76 and wafer paddle 74a aboutpaddle axis 78 to form the straight-line path 110. Straight-line path110 can be achieved, for example, by rotating platform 70 in a clockwisedirection while rotating paddle 74a in a counter-clockwise direction atpreselected angular speeds.

After it is removed from storage cassette 26 along straight-line path110, wafer 34 is rotated about paddle axis 78 and positioned in front ofcentral pedestal 104. Wafer 34 is transferred from wafer paddle 74a tocentral vacuum chuck 82 by the coordinated release of vacuum pressure topaddle vacuum chuck 80a and application of vacuum pressure to centralvacuum chuck 82. Since it is able to transport wafer 34 along astraight-line path, wafer handler 28 is compatible for use with standardwafer storage cassettes and processing equipment employed in integratedcircuit manufacturing facilities.

One of the tasks wafer handler 28 performs is an edge scan operation toobtain a polar map of the periphery of wafer 34. The polar map data aremanipulated in accordance with appropriate algorithms to compute thecenter and orientation of wafer 34. More specifically, wafer handler 28performs the edge scan by rotating an optical scanning assembly 114 onplatform 70 about the perimeter 116 of wafer 34. Upon completion of theedge scan, wafer handler 28 computes the position and orientation ofwafer 34. Wafer handler 28 optionally performs a second scan to read abar code symbol 118 (outlined in phantom in FIG. 6) positioned on thebottom major surface 120 of wafer 34, in a manner described in copendingU.S. patent application Ser. No. 07/317,227, filed Feb. 27, 1989, nowU.S. Pat No. 5,015,832, for Method of and Apparatus for Decoding BarCode Symbols, which is assigned to the assignee of the presentapplication. Wafer handler 28 uses paddle 74a to center and orient wafer34 so that it can be positioned properly on X-Y stage 30.

FIG. 6 is a side elevation view of platform 70 with wafer 34 secured tocentral vacuum chuck 82. Wafer handler 28 performs an edge scan of wafer34 by rotating optical scanning assembly 114 about the perimeter 116 ofwafer 34, which is held in a fixed position by central vacuum chuck 82.Optical scanning assembly 114 includes a light emitting means or diode122 and an adjacent photodetector 124 that travel along a rack gear (notshown) positioned behind a slot 126 in platform 70. Slot 126 extendsradially from central axis 76 toward the side of platform 70 oppositethe side on which paddle pedestal 106 is positioned.

FIG. 7 is a simplified block diagram of a scan data processing system130 that cooperates with optical scanning assembly 114 to compute theposition and orientation of wafer 34. During the edge scan of wafer 34,light emitting diode 122 of optical scanning assembly 114 directs alight beam 132 of a previously measured maximum intensity toward bottomsurface 120 of wafer 34.

Whenever optical scanning assembly 114 is positioned along slot 126 at aradial distance less than that of perimeter 116, substantially all oflight beam 132 is reflected toward photodetector 124, which delivers aposition feedback signal in a LIGHT state to a scanning assembly motordrive controller 134. In response to the position feedback signal in theLIGHT state, motor drive controller 134 directs a scanning assemblymotor (not shown) to rotate the rack gear and increase the radialdistance at which optical scanning assembly 114 is positioned, therebyto move optical scanning assembly 114 toward perimeter 116 of wafer 34.

Whenever optical scanning assembly 114 is positioned along slot 126 at aradial distance greater than that of perimeter 116, none of light beam132 is reflected toward photodetector 124, which delivers a positionfeedback signal in a NO LIGHT state to scanning assembly motor drivecontroller 134. In response to the position feedback signal in the NOLIGHT state, motor drive controller 134 directs the scanning assemblymotor to rotate the rack gear and reduce the radial distance at whichoptical scanning assembly 114 is positioned, thereby to move opticalscanning assembly toward perimeter 116 of wafer 34.

Whenever optical scanning assembly 114 is positioned along slot 126 at aradial distance aligned with that of perimeter 116, a predeterminedportion of light beam 132 is reflected toward photodetector 124, whichdelivers a position feedback signal in an ALIGNED state to scanningassembly motor drive controller 134. In response to the positionfeedback signal in the ALIGNED state, motor drive controller 134maintains the radial distance at which optical scanning assembly 114 ispositioned. As a result, the position feedback signal in the ALIGNEDstate is indicative of the radial position of perimeter 116 of wafer 34.The feedback circuit components are of such values that optical scanningassembly 114 tracks significant changes in the perimeter 116 of wafer 34over relatively small angular displacements, such as thosecharacteristic of a notch in the wafer.

A platform motor drive controller 136 controls a waist motor thatrotates platform 70 and optical scanning assembly 114 about central axis76. Platform motor drive controller 136 also delivers at regular timeintervals a sampling control signal to a control input 138 of a samplingcircuit 140. The regular time intervals correspond to unit incrementalangular movements (e.g., one arc second, which is approximately 0,003degrees) of platform 70 and optical scanning assembly 114. The samplingcontrol signal corresponds, therefore, to an angular position of opticalscanning assembly 114 relative to wafer 34.

A sample input 142 of sampling circuit 140 receives from scanningassembly motor drive controller 134 a position signal corresponding tothe radial position of optical scanning assembly 114 in alignment withperimeter 116. In response to the sampling control signal received fromplatform motor drive controller 136, sampling circuit 140 samples theposition signal delivered to input 142 from scanning assembly motordrive controller 134. The sampling control signal and correspondingposition signal correspond, respectively, to the polar coordinates θ andr of perimeter 116 of wafer 34.

During the edge scan about perimeter 116 of wafer 34, sampling circuit140 transfers the polar coordinate data to a data storage means orcircuit 144. After a complete edge scan about perimeter 116 (i.e., ascan of 360 degrees), data storage circuit 144 contains a complete polarcoordinate map representing perimeter 116 of wafer 34.

Microprocessor 112 uses the polar coordinate map stored in data storagecircuit 144 to determine the position of the center 146 of wafer 34relative to central axis 76 and to determine the angular locations of aflat 148 (FIG. 2) and a notch 150 (FIG. 2) on perimeter 116. Flat 148and notch 150 are standard features on a semiconductor wafer and areindicative of its orientation.

Microprocessor 112 determines the location of center 146, flat 148, andnotch 150 of wafer 34 to allow wafer handler 28 to correctly positionwafer 34 on X-Y stage 30. Typically, wafer handler 28 repositions wafer34 so that its center 146 is aligned with central axis 76 prior tomovement of wafer 34 to X-Y stage 30. The polar coordinate map stored indata storage circuit 144 also allows wafer handler 28 to read bar codesymbol 118 by rotating optical scanning assembly 114 past bar codesymbol 118, i.e., during a bar code scan.

An operator-entered or programmed instruction initiates a commandsequence within microprocessor 112 that causes wafer handler 28 tomaneuver top cylinder 110a and paddle structure 72 to pick up wafer 34from platform 70 and deliver wafer 34 to X-Y stage 30. During this time,microprocessor 112 provides a signal to X-Y stage 30 to move its upperstage 84 into a docked position (shown in phantom outline in FIG. 4C) toreceive wafer 34 over vacuum chuck 86. Microprocessor 112 uses the knownposition coordinates of the docked upper stage 84 and the previouslycomputed location of flat 148 of the centered wafer 34 to determine atrajectory that will position wafer 34 in the desired location on X-Ystage 30. Microprocessor 112 derives the necessary signals for the drivemechanism that rotates platform 70 and paddle structure 72 to deliverwafer 34 along the computed trajectory path.

During inspection, the operator positions X-Y stage 30 as desired toalign selected regions of patterned surface 54 of wafer 34 within thefield of view of microscope objective 52. In a preferred embodiment, X-Ystage 30 is of the type in which upper stage 84 is rotatable about andmovable along an axis parallel to central axis 76 to, respectively,orient the patterned surface of wafer 34 and achieve a sharp focus withobjective 52. Upon completion of an inspection, upper stage 84 returnsto its docked position to enable paddle 74b to retrieve wafer 34 andreturn it to its preassigned slot in storage cassette 26. It will beappreciated that a second wafer secured by vacuum pressure to paddle 74acan be delivered to X-Y stage 30 immediately after paddle 74b retrieveswafer 34 from X-Y stage 30 to thereby enhance wafer inspectionthroughput.

The layout of the wafer storage and transport components of specimenprocessing station 10 maintains the patterned surface 54 of wafer 34 ina vertical orientation and, as a consequence, subjects it togravitational force at all times. Processing station 10 incorporates,therefore, protection systems that safeguard against the dropping ofwafer 34 should a loss of electrical power or vacuum pressure occur.FIG. 8 shows a composite block diagram of certain components of theelectrical power and vacuum pressure subsystems of processing station 10and a flow diagram indicating the process steps carried out byprocessing station 10 in the event of a loss of electrical power orvacuum pressure.

With reference to FIG. 8, processing station 10 provides to itselectrical subsystems the necessary operating voltages from anuninterruptible power supply (UPS) 160 which has an energy storagecapability (e.g., a continuously charged auxiliary battery) to maintainfor a time output voltages at their nominal levels. UPS 160 is acommercially available device, such as a Model 8413001, manufactured byTopaz, Inc., San Diego, Calif. UPS 160 provides on an output 162 asignal indicative of whether the primary source for UPS 160 isoperational. Output 162 of UPS 160 is connected to a first input of aninterrupt controller 164 whose output 166 provides an interrupt signalthat commences an interrupt command sequence for operating wafer handler28 and X-Y stage 30 in the manner described below.

Processing system 10 delivers to the vacuum chucks of wafer handler 28and X-Y stage 30 vacuum pressure generated by a vacuum generator 170.Vacuum generator 170 delivers vacuum pressure through a conduit 172 towhich a vacuum pressure sensor 174 is connected to monitor the vacuumpressure level. A vacuum failure detection circuit 176 operativelyassociated with pressure sensor 174 provides on output 178 a signalindicative of a loss of vacuum pressure. The signal on output 178 isdelivered to a second input of interrupt controller 164 and to a controlinput of a check valve 180 positioned within conduit 172. Check valve180 is connected in series with a vacuum accumulator 182, which has alarge volume that functions as a temporary vacuum storage device.

In the event of vacuum pressure loss, a signal present on output 178 ofdetection circuit 176 closes check valve 180 to provide a high vacuumpressure resistance to the input 184 of accumulator 182. Under theseconditions, vacuum pressure stored by accumulator 182 is communicatedonly through its output manifold 186, which is connected to vacuumchucks 80a, 80b, and 82 of wafer handler 28 and vacuum chuck 86 of X-Ystage 30. The amount of vacuum pressure delivered to each of the vacuumchucks is determined by a vacuum chuck controller 188 in response tosignals provided by microprocessor 112.

Whenever it receives a power loss signal on output 162 of UPS 160 or avacuum loss signal on output 178 of detection circuit 176, interruptcontroller 164 initiates the following sequence of operations. Againwith reference to FIG. 8, process block 190 indicates thatmicroprocessor 112 determines whether a wafer is present on waferhandler 28 or X-Y stage 30. This determination is accomplished byinterrogating the status of the vacuum control demands delivered tovacuum chucks controller 188.

Process block 192 indicates that wafer handler 28 reacts to return tostorage cassette 26 any wafer held by paddle 74a or paddle 74b. Therequired trajectories are readily computed from the known position ofthe appropriate cassette slot, the present position of the wafer onwafer handler 28, the orientation of paddle structure 72, and theposition of top cylinder 100a.

Decision block 194 indicates a determination of whether thedetermination represented by process block 190 revealed the presence ofa wafer on upper stage 84 of X-Y stage 30.

If there is no wafer on X-Y stage 30, process block 196 indicates thattop cylinder 100a and paddle structure 72 assume predetermined positionsthat represent an inherent balance condition for wafer handler 28. Thebalance condition prevents top cylinder 100a and paddle structure 72from rotating under the force of gravity in directions that would movepaddle structure 72 downwardly toward storage cassette 26, which couldbe struck and whose contents could be damaged by paddle 74a or 74b.

If there is a wafer on X-Y stage 30, decision block 198 indicates adetermination of whether the position coordinates of upper stage 84 ofX-Y stage 30 correspond to the docked position, which represents theposition that enables wafer handler 28 to acquire a wafer positioned onX-Y stage 30. If X-Y stage 30 is not in the docked position, processblock 200 indicates that microprocessor 112 delivers the necessarycommand to position X-Y stage 30 to the docked position.

Upon docking of X-Y stage 30, process block 202 indicates that waferhandler 28 acquires the wafer held by X-Y stage 30 in the dockedposition. The flow diagram shows the return to process block 190, whichindicates the sensing of the wafer location so that microprocessor 112can compute the trajectory path required to return the wafer to its slotin storage cassette 26 or otherwise secure the wafer. There will then beno wafer on X-Y stage 30, as determined at decision block 194; and waferhandler 28 will rest at its balanced position, as indicated by processblock 196.

The foregoing operations are completed before UPS 160 no longer providesthe nominal voltages or accumulator 182 ceases to provide sufficientvacuum to prevent dropping of wafers. Vacuum accumulator 182 hassufficient capacity to support the specimen on X-Y stage 30 and/or waferhandler 28 for a sufficient time to permit completion of a critical orin-progress task and to thereafter secure the specimen. Alternatively, abackup vacuum system may be utilized that would permit continuedprocessing after failure to malfunctioning of the primary vacuumgenerator. It will be appreciated that the resting of wafer handler 28at its balanced position is unnecessary for a vacuum pressure loss notresulting from an electrical power failure.

FIG. 9 shows a vertical processing station 210 employing an exemplarydrilling apparatus 220 in place of microscope 32 shown in FIG. 2.Similar components in FIGS. 9 and 2 are labelled with identicalreference numerals. It will be recognized by those having skill in theart that a wide variety of processing apparatus may be substituted foror mounted in conjunction with microscope 32.

With reference to FIG. 9, drilling apparatus 220 of processing station210 employs a vertical drill support 212 to support a drill 214 inproximity to wafer 34 on X-Y stage 30. A drill bit 216 extends fromdrill 214 toward wafer 34 to perform an operation on the surface 54 ofwafer 34. Optical beamsplitter 50 of FIG. 2 is replaced with areflecting mirror 218. Many other types of processing implements may beutilized in the processing apparatus of the present invention. Ingeneral, the processing implement is mounted in an orientation generallyperpendicular to the plane of the specimen supported on the stage meansand is movable or reciprocable toward and away from the specimen duringprocessing operations.

It will be obvious to those having skill in the art that many changesmay be made to the details of the above-described preferred embodimentof the present invention without departing from the underlyingprinciples thereof. For example, the vertical orientation of the stationcomponents readily facilitates an upscaling of the station toaccommodate the processing of other specimens, such as electroniccomponents (e.g., large area liquid crystal displays, printed circuitboards, or photomasks), mechanical subassemblies, or chemical products.In connection with securing some type of specimens to the transportmechanism and the X-Y stage, an electromagnet arrangement could besubstituted for the vacuum chuck arrangement described in the preferredembodiment. The scope of the present invention should, therefore, bedetermined only by the following claims.

We claim:
 1. A specimen processing station, comprising:a specimenstorage support for storing a specimen in a generally verticalorientation; a specimen stage for supporting the specimen in a generallyvertical orientation and translating the specimen in a vertical plane topresent different regions of the specimen for processing; an automatedspecimen transporter movable in at least two dimensions for transportingthe specimen between the specimen storage support and the stage; and aspecimen processor for performing a processing operation on the specimensupported in a generally vertical orientation on the stage.
 2. Thespecimen processing station of claim 1, wherein the specimen transporterincludes a paddle that is operable to acquire the specimen from thespecimen storage support and transport the specimen in a generallyvertical orientation to the stage.
 3. The specimen processing station ofclaim 1, further comprising a vacuum pressure source for supplyingvacuum pressure to the specimen transporter to secure the specimen tothe specimen transporter during transport of the specimen from thespecimen storage support to the stage.
 4. The specimen processingstation of claim 1, further comprising an electrical energy source forsupplying electrical energy to the specimen processing station and anelectrical energy sensor to detect a change in electrical energydelivered to the specimen processing station.
 5. The specimen processingstation of claim 4, wherein the specimen transporter returns to thespecimen storage support a specimen supported on the stage or beingtransported between the specimen storage support and the stage inresponse to a change in electrical energy delivered to the specimenprocessing station detected by the electrical energy sensor.
 6. Aspecimen processing station, comprising:a specimen storage support forstoring a specimen; a specimen stage for supporting the specimen in agenerally vertical orientation by means of vacuum pressure; a specimentransporter for transporting the specimen between the specimen storagesupport and the stage; a specimen processor for performing a processingoperation on a specimen supported in a generally vertical orientation onthe stage; and a vacuum pressure level sensor for detecting a change invacuum pressure at the stage means.
 7. The specimen processing stationof claim 6, wherein the specimen transporter returns to the specimenstorage support a specimen supported on the stage or being transportedbetween the specimen storage support and the stage in response to achange in vacuum pressure at the stage.
 8. The specimen processingstation of claim 6, additionally comprising a vacuum accumulator adaptedto deliver vacuum pressure to the stage in response to detection of adecrease in vacuum pressure at the stage means.
 9. A specimen processingstation, comprising:a specimen storage support for storing a specimen; astage for supporting the specimen in a generally vertical orientation; aspecimen transporter rotatable in a vertical plane for transporting thespecimen between the specimen storage support and the stage; and aspecimen processor for performing a processing operation on a specimensupported in a generally vertical orientation on the stage.
 10. Thespecimen processing station of claim 9, additionally comprising a vacuumpressure level sensor adapted to detect a change in vacuum pressure atthe specimen transporter.
 11. The specimen processing station of claim10, additionally comprising a vacuum accumulator adapted to delivervacuum pressure to the specimen transporter in response to detection ofa decrease in vacuum pressure at the specimen transporter.
 12. Thespecimen transport station of claim 9, wherein the stage supports thespecimen in a generally vertical orientation by means of vacuumpressure.
 13. The specimen processing station of claim 9, furthercomprising an electrical energy source supplying electrical energy tothe specimen processing station and an electrical energy sensor todetect a change in electrical energy delivered to the specimenprocessing station.
 14. The specimen processing station of claim 9,wherein the specimen storage support is adapted to store the specimen ina generally vertical orientation and the specimen transporter is adaptedto transport the specimen between the specimen storage support and thestage in a generally vertical orientation.